Chinese chipset manufacturer MediaTek has reportedly been working on their new chipset duo entitled as Helio X30 and X35. Both of these chipsets has been known to make full use of TSMC’s 10nm process, making them the customer of TSMC group alongside Apple.
As reported the Helio X30 will process more power between the duo despite carrying a small number. The new X30 chipset can be considered as the piece of engineering tech since its application processor is known to be fitted with 10 cores. While the set of two Cortex-A73 cores is believed to be clocked at 2.8GHz max for handling intensive tasks, whereas the other four Cortex-A53 will be clocked at 2.2GHz mainly for backup, and the last four Cortex-A35 cores will be working to handle simple tasks with a clock speed of 2.0GHz. The Helio X30 chipset carrying an intense power is expected to make a place in the list alongside Qualcomm’s Snapdragon and Samsung’s Exynos chipsets.
The Helio X30 will be able to handle up to 8GB of RAM, and will support Google’s Daydream VR – thanks to quad-core PowerVR graphics it packs. As reported the production of MediaTek X30 and X35 chipset will start at the end of 2016 or at the very first beginning year of 2017.
via: Phone Arena
