MediaTek’s in the vouch of creating affordable 5G smartphones and a part of the process is the new Dimensity 700 chipset fabricated on 7nm tech, which is quite similar to the recently unveiled Dimensity 720 SoC.
The major highlight here is the 5G modem with carrier aggregation. This allows faster speed and connection with up to 2.77 Gbps of downlink speeds and switches between 5G cells without any hiccups. It also supports Dual SIM, Dual Standby, and VoNR (Voice over New Radio) with better audio quality than prior generations.
The modem also brings global 5G NR band support and “5G UltraSave” technology from MediaTek.
Taking an in-depth look at the Dimensity 700, it has two Cortex-A76 cores clocking at 2.2GHz — a bit faster than the 720’s big CPU — and six Cortex-A55 cores at 2.0GHz. The SoC supports up to 12GB of LPDDR4X RAM and UFS 2.2 two-lane storage with up to 1GB/s transfer speeds.
The new chipset can also power 1080p+ displays at a 90Hz refresh rate over the ARM Mali-G57 MC2 GPU — downgraded from the G57 MC3 in the 720.
The Dimensity 700 is ok-ish in terms of video capturing capabilities — it can shoot 1080p videos, while on the other hand, the 720 can shoot up to 4K videos, putting it in the mid-range section. For photos, this one can have up to 64MP cameras and feature multi-frame noise reduction and plethoras of AI improvements.
About the AI, the SoC can run some decent number of voice assistants from the likes of Google, Amazon, Alibaba, Tencent, and Baidu.
Besides that, MediaTek has not revealed anything about the Dimensity 700 availability, but we expect it to ship in upcoming entry-level or mid-range smartphones, most probably from Xiaomi or Realme.
