Qualcomm initiates the MWC 2021 with the first major unveiling — it launches the Snapdragon 888 Plus chipset with a 3GHz CPU core and an improved AI Engine said to perform 20% better than its predecessor.
The Snapdragon 888 Plus is almost as same as its previous counterpart, the SD 888 which went live back in December with the ARM Cortex-X1 core. The major difference here is that the Plus model has an increased clock speed up to 2.995GHz.
- CPU: Qualcomm Kryo 680, up to 3GHz clock speed, 64-bit
- GPU: Adreno-660
- AI Engine: Hexagon 780, 32TOPS
- Modem: Snapdragon X60 5G Modem-RF, 7.5 Gbps Download, 3 Gbps Upload, global 5G multi-SIM
- Wi-Fi: FastConnect 6900, Wi-Fi 6E, Wi-Fi 6, Wi-Fi 5, Wi-Fi 802.11/a/b/g/n
- Camera: Spectra 580 ISP, Triple-camera up to 28MP, Dual-camera up to 64MP, Single-camera up to 200MP. 720p @ 960 fps, 8K @ 30 fps
- Display: 4K @ 60Hz, QHD+ @ 144Hz
- Fabrication technology: 5nm
- Other Features: Bluetooth 5.2, USB 3.1
There’s also Qualcomm’s Hexagon 780 AI processor which offers 32TOPS (Tera Operations Per Second), which is an upgrade over 26TOPS on the vanilla Snapdragon 888.
Apart from that, nothing much has changed — it still has the same Adreno 660 GPU, Snapdragon X60 5G modem with 7.5 Gbps top download speed, and FastConnect 69000 that opens the gate for all the latest Wi-Fi standards for pristine download speed.
The new Snapdragon 888 Plus will reportedly hit upcoming devices from Xiaomi, Motorola, Asus, Honor, and Vivo; as confirmed by each company’s representatives, as early as Q3 2021.
